FUTURE3-5

Luxembourg

Layers to shuffle and recombine

FUTURE 3-5 explores layered semiconductor stacks as a flexible platform — materials and device fragments brought together in new combinations.

Public overview · concept

Six material motifs to recombine — SiC, GaN, AlN / AlScN, Diamond, Photonics, CMOS-compatible stacks
From the FUTURE 3-5 concept deck — motifs, not product claims

About

We work at the intersection of wide-bandgap materials and device design. The idea is simple: treat stacks as something you can recombine — opening room for new device architectures without locking into a single recipe.

Stack recombination

Illustrative only: materials as layers that can be ordered, swapped and combined — the working metaphor for how FUTURE 3-5 thinks about device platforms.

Shuffle the stack — pull one layer out, then recombine with something new
Shuffle the stack — concept, illustrative

Public concept graphics from the FUTURE 3-5 deck — not process data or device specifications.

FAB35

A mini R&D fab in Luxembourg

FAB35 is our planned mini R&D facility. The name nods lightly to fab numbering and to a 2035 technology horizon — a place to build, test and iterate stacks at research scale.

  1. 1 Build Grow and assemble layered stacks at research scale
  2. 2 Test Characterise materials and device fragments
  3. 3 Iterate Recombine recipes toward CMOS-compatible windows
Growth Metrology Iterate
Illustrative FAB35 flow — not a floor plan

Contact

For general enquiries about FUTURE 3-5 and FAB35, use the contact details we share when we reach out, or ask via your usual channel with the team.

A public email address will be added once the domain mailbox is live.